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Printed electronics represent an emerging area of research that promises large markets due to the ability to bypass traditional expensive and inflexible silicon-based electronics to fabricate a variety of devices on flexible substrates using high-throughput printing approaches. This article presents a summary of work to date in the field of printed electronics and the materials chemistry involved. In particular, the focus is upon the use of metal- and metal oxide-containing inks in the preparation of contacts and interconnects. The review discusses the challenges associated with processing these types of inks and ways to successfully obtain the desired features.
Perelaer et al. (Fri,) studied this question.
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