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High‐voltage pn‐diodes , and silicon on insulator (SOI) materials are two applications that could benefit from a new method of wafer bonding which can be carried out in a normal laboratory environment. The procedure, which involves spinning the wafers at high speed (see figure) thus creating a “micro‐cleanroom” between them, could also have applications in micro‐mechanical work and wafer protection. equation image
Lehmann et al. (Wed,) studied this question.
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