This paper presents an innovative multi-criteria visual quality control algorithm designed for deployment on cost-effective Edge devices within the Industrial Internet of Things environment. Traditional industrial vision systems are typically associated with high acquisition, implementation, and maintenance costs. The proposed solution addresses the need to reduce these costs while maintaining high defect detection efficiency. The developed algorithm largely eliminates the need for time- and energy-intensive neural network training or retraining, though these capabilities remain optional. Consequently, the reliance on human labor, particularly for tasks such as manual data labeling, has been significantly reduced. The algorithm is optimized to run on low-power computing units typical of budget industrial computers, making it a viable alternative to server- or cloud-based solutions. The system supports flexible integration with existing industrial automation infrastructure, but it can also be deployed at manual workstations. The algorithm’s primary application is to assess the spread quality of thick liquid mold filling; however, its effectiveness has also been demonstrated for 3D printing processes. The proposed hybrid algorithm combines three approaches: (1) the classical SSIM image quality metric, (2) depth image measurement using Intel MiDaS technology combined with analysis of depth map visualizations and histogram analysis, and (3) feature extraction using selected artificial intelligence models based on the OpenCLIP framework and publicly available pretrained models. This combination allows the individual methods to compensate for each other’s limitations, resulting in improved defect detection performance. The use of hybrid metrics in defective sample selection has been shown to yield superior algorithmic performance compared to the application of individual methods independently. Experimental tests confirmed the high effectiveness and practical applicability of the proposed solution, preserving low hardware requirements.
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Piotr Lech
Bydgoszcz University of Science and Technology
Electronics
West Pomeranian University of Technology
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Piotr Lech (Tue,) studied this question.
synapsesocial.com/papers/68a36c2e0a429f79733303ea — DOI: https://doi.org/10.3390/electronics14163204
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