Gallium nitride high electron mobility transistors (GaN HEMTs), characterized by their extremely high switching speeds and superior high-frequency performance, have demonstrated significant advantages, and gained extensive applications in fields such as aerospace and high-power-density power supplies. However, their unique internal architecture renders these devices highly sensitive to circuit parasitic parameters. Conventional circuit design methodologies often induce severe issues such as overshoot and high-frequency oscillations, which significantly constrain the realization of their high-frequency performance. To solve this problem, this paper investigates the nonlinear dynamic behavior of GaN HEMTs during switching transients by establishing an equivalent impedance model. Based on this model, a detailed analysis is implemented to elucidate the mechanism by which RC Snubber circuits influence the system’s resonance frequency and the amplitude at the resonant frequency. Through this analysis, an optimal RC Snubber circuit parameter is derived, enabling effective suppression of high-frequency oscillations during the switching transient of GaN HEMT. Experimental results demonstrate that the proposed design achieves a maximum reduction of 40% in voltage overshoot, shortens the ringing time to one-twentieth of the original value, and suppresses noise by 20 dB in the high-frequency range of 20 MHz to 30 MHz, thereby significantly enhancing the stability and reliability of circuit operation. Additionally, considering the heat dissipation requirements in high power density scenarios, this work optimizes the layout of devices, and heat sinks to maintain operational temperatures within safe limits, further mitigating the impact of parasitic parameters on overall system performance.
Liu et al. (Tue,) studied this question.