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This is a Quantitative Study study.

October 9, 2025

Amalgams As Alternative Microelectronic Interconnect Materials

DBDaniel F. BaldwinCenter for Astrophysics Harvard & Smithsonian RDRohit DeshmukhCalifornia Institute of Technology CHChristine S. HauMassachusetts Institute of Technology

Key Points

Amalgam compositions show adequate adhesion to common metallization systems, improving microelectronic reliability.
Cured amalgams form intermetallic compounds, contributing to their hardness and suitability for electronic applications.
Gallium amalgams exhibit excellent wetting on various surfaces, facilitating their use in microelectronic interconnects.
A new micro-dispensing technology enhances the production efficiency of these lead-free interconnect materials.

Abstract

Abstract Gallium amalgam alloys are investigated for lead-free microminiature interconnect materials. The applicability of amalgam interconnects is explored through basic materials characterizations, wetting, dispensing, and adhesion studies. Two amalgam compositions consisting of (65% Ga - 30% Cu - 5% Ni) and (60% Ga - 32% Cu - 8% Ni) are studied. Through the course of this work a new micro-dispensing technology was developed which leverages existing industry infrastructure. These studies show amalgams can be formed uniformly and cured to a high degree of hardness. The uncured amalgams wet the majority of surfaces encountered in electronic interconnects, which include bare copper, Cu/Ni/Au, Al/Cu/Ni/Au, Al/Ti/Pt/Au, and aluminum metallization. Microstructural analysis of the cured amalgams reveals the formation of Ga-Cu and Ga-Ni intermetallic compounds and voids. In addition, the amalgams exhibit adequate adhesion by forming relatively strong interfacial bonds with common metallization systems.

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