November 1, 1991Journal of The Electrochemical Society512 citations

Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

FKF. B. KaufmanBen-Gurion University of the Negev DTDaniel B. ThompsonUniversity of California, Santa Barbara RBR. E. BroadieIBM (United States)

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Abstract

Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects, Kaufman, F. B., Thompson, D. B., Broadie, R. E., Jaso, M. A., Guthrie, W. L., Pearson, D. J., Small, M. B.

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