首页
探索
nav.journalClub
趋势
更多
Synapse
⌘+K
Synapse
语言
简体中文
简体中文
Jason D. Reed | Synapse
JD
Jason D. Reed
3D IC and TSV technologies
University of Rochester
Share
Follow
Claim This Profile
About
Research focus
3D IC and TSV technologies
Impact
37 pubs · 674 cites · h-index 11
Affiliations
University of Rochester
RTI International
Phononic Devices (United States)
See all
Publications