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The interfacial adsorption structure of an organic leveler decides its functionality in Cu interconnect electroplating and is yet far from clear. In this work, in situ attenuated total reflection surface-enhanced infrared absorption spectroscopy (ATR-SEIRAS) and electrochemical quartz crystal microbalance (EQCM) in conjunction with density functional theory (DFT) calculations are applied to unravel the interfacial adsorption of the classic dye leveler Janus Green B (JGB) at a Cu electrode and understand its polarization property against Cu electrodeposition from an adsorption structure perspective. ATR-SEIRAS measurements and DFT calculations reveal that the N=N bond of the JGB molecule splits via reductive hydrogenation, forming two fragments of contrasting adsorption configurations. JGB exhibits the strongest inhibition effect on Cu deposition among all the tested additives including individual and mixed fragments, due to the highest coverage of organic adsorbates from JGB dissociation, as measured by EQCM. This work highlights the advantage of surface sensitive analytical tools in understanding the structure–performance of levelers.
Mao et al. (Thu,) studied this question.