Surface modification of silver nanoparticles with self-assembled monolayers to mitigate electrochemical migration in fine-pitch interconnects | Synapse
March 3, 2026
Surface modification of silver nanoparticles with self-assembled monolayers to mitigate electrochemical migration in fine-pitch interconnects
Key Points
Reduction in electrochemical migration rates was observed with surface-modified silver nanoparticles, enhancing performance.
A significant decrease was noted, particularly in high-density interconnect scenarios, confirming the efficacy.
Surface modification was achieved using self-assembled monolayers to initiate better protection against migration.
These findings highlight the potential for longer-lasting electronic connections, emphasizing reliability in advanced technologies.