Research progress on galvanic corrosion mechanisms and suppression strategies in Cu interconnect CMP processes for IC

Key Points

• Galvanic corrosion in copper interconnects can significantly affect performance and reliability of integrated circuits.
• The study identifies key mechanisms of corrosion, reporting that specific suppressive strategies can mitigate these effects.
• Observational analysis across various CMP processes highlights the importance of understanding corrosion in IC fabrication during production stages.
• Understanding these mechanisms may enable the development of more robust materials and practices in the microelectronics industry.