Near-zero thermal expansion CPO-TLCP composites achieved by in-situ copolymerization: A solution for dimensional stability in electronic devices

Key Points

• Near-zero thermal expansion enhances dimensional stability in electronic devices, crucial for performance.
• CPO-TLCP composites demonstrate a significant reduction in thermal expansion variability under stress conditions.
• Analysis highlights the successful in-situ copolymerization method that achieves desired thermal properties.
• These findings may enable more durable electronic devices, reducing failure rates linked to thermal challenges.