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March 3, 2026Microelectronics Reliability2 citations

Long-term drift of a bandgap voltage reference by molding compound oxidation during extended thermal aging

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EAEdinso Gabriel Marina AlonzoRRRené Theodora Hubertus RongenMSM. van Soestbergen

Key Points

  • Voltage references exhibit drift over long-term thermal aging, driven significantly by molding compound oxidation.
  • The study found a notable voltage change of 20 mV after 1000 hours at 125°C due to oxidation effects.
  • Analysis of thermal aging under accelerated conditions was performed to evaluate voltage reference stability across various environments.
  • These findings highlight the need for enhanced material stability to improve the reliability of electronic components under thermal stress.
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Cite This Study

Alonzo et al. (2026) studied this question.

synapsesocial.com/papers/69a761eac6e9836116a3000bhttps://doi.org/10.1016/j.microrel.2026.116043
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