Additive Manufacturing (AM) and printing-based fabrication technologies have emerged as powerful enablers for next-generation electronic integration and packaging, addressing the growing limitations of conventional subtractive manufacturing techniques. As electronic systems continue to scale toward higher operating frequencies (10–110 GHz and beyond) and increased functional density (>104 interconnects/cm2), traditional packaging approaches struggle with rigid design constraints, complex processing steps (>15–25 fabrication steps), high tooling costs (10, 000–100, 000 for mask and molds) and limited compatibility with heterogeneous integration. In this review, a comprehensive and critical overview of major additive manufacturing and printing technologies including aerosol jet printing, inkjet printing, vat polymerization, fused filament fabrication (FFF) and nScrypt printing is presented from the perspective of electronic assembly and packaging. The fundamental working mechanisms, material compatibility, resolution limits, scalability, and reliability considerations of each technique are systematically discussed. From a manufacturing standpoint, AM reduces material waste by 50–90% compared to subtractive PCB processing and eliminates tooling costs, enabling low-volume prototyping with per-unit fabrication costs reduced by 30–70% for small batches (100 cm2/min for scalable inkjet systems. Moreover, it is discussed how these technologies enable advanced packaging architectures such as printed signal crossovers, three-dimensional interconnects, ramps, and embedded chip assemblies. Recent research efforts and reported demonstrations are analyzed to highlight the advantages and current limitations of additive manufacturing for high-frequency, RF, and system-on-package (SoP) applications. Finally, future directions and remaining challenges are discussed, including advances in materials, custom and on-demand manufacturing, enhanced design freedom, integration of multifunctionality, cost-effectiveness, and smart packaging solutions. This review aims to serve as a reference for researchers and engineers seeking to leverage additive manufacturing for high-performance electronic integration and next-generation electronic packaging solutions.
Singh et al. (Wed,) studied this question.