ABSTRACT A water‐insoluble Schiff base sorbent is prepared, characterized, and used to remove copper (II) Cu 2+ ions from water. Batch sorption tests are conducted to determine optimal parameters for Cu 2+ removal. The results show that, the removal rate is linearly proportional to sorbent dose in the solution, and the maximum removal is achieved at a sorbent dose of 80 mg in 25 mL of solution. The initial solution pH strongly affects the removal rate, and the sorption performance of the sorbent is more pronounced at acidic pH. The sorption of Cu 2+ onto the prepared sorbent reaches equilibrium within 2 h. The results of the regeneration test show that 0.01 M citric acid completely regenerates the exhausted sorbent. Next, the sorbent undergoes rigorous testing to assess its efficacy in removing Cu 2+ from a water sample from a Cu‐plating rinse bath. The compelling sorption results unequivocally demonstrate its remarkable ability to extract Cu 2+ from real water, even in the presence of complexion mixtures.
Alkan et al. (Fri,) studied this question.
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