What question did this study set out to answer?

The aim is to develop a compact RF test module that enhances throughput in RF ATE systems.

April 25, 2026IEICE Transactions on Electronics0 citationsOpen Access

High Density Front-End Technologies for RF ATE with Multiple Resources and High Throughput Testing

MKMasayuki KimishimaJapan Advanced Institute of Science and Technology

Key Points

The aim is to develop a compact RF test module that enhances throughput in RF ATE systems.
Developed a downsized RF test module using RF-SiP technology.
Eliminated the need for RF cables and connectors to decrease size.
Implemented high-speed RF switching for multiple resource installation.
Achieved a drastically smaller RF front-end module leading to better resource management.
Enhanced throughput for RF testing resulting in significant test cost reductions.

Abstract

A drastically downsized RF test module with multiple resources and high throughput for RF ATE (Automated Test Equipment) systems is described. The RF circuit technology in the form of RF functional systems in package (RF-SiPs) is applied to construct extremely small size RF front-end without both RF cables and RF connectors. In addition, high-speed RF switching operations are also achieved. Consequently, installation of multiple resources and higher throughput for RF testing has been accomplished, resulting in reduced RF test costs.

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