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May 14, 2026Scientia Sinica Informationis0 citations

Large Models for Integrated Circuit: Driving Leapfrogging Advances in IC Manufacturing Technologies

QSQi SunJDJinyuan DengQJQian Jin

Key Points

  • The study aims to identify the challenges and opportunities of using large models in integrated circuit manufacturing processes.
  • Focuses on the integration of multimodal data, physical mechanisms, and domain knowledge into model design.
  • Analyzes the current state and challenges of large model applications in IC manufacturing.
  • Identifies key challenges like heterogeneous data and complex process integration in IC manufacturing.
  • Suggests the need for tailored large model systems that enhance efficiency and precision in manufacturing.

Abstract

随着先进工艺节点的持续演进，集成电路制造工艺复杂性显著提升，产业对跨层次、多模态和智能化制造能力提出了更高要求.传统制造技术主要依赖专家经验、物理机理与数理模型，在应对工艺迭代、流程优化以及跨场景技术迁移方面能力明显不足，迫切需要具备泛化能力和产业适配性的智能化技术体系.近年来，大模型在多个领域展现出卓越的知识抽象、语义理解与泛化能力，为推动集成电路制造技术智能化发展提供了新的契机.然而，集成电路制造通常伴随多模态异构数据、小样本、复杂工艺耦合，以及效率与精度难以兼顾等复杂特性，使得通用大模型难以直接适用.因此，亟需在模型设计中有机融合多模态数据、物理机理与领域知识，构建面向制造环节的专用大模型体系.本文聚焦集成电路制造的核心难点与关键挑战，介绍集成电路大模型发展现状，并展望未来发展路线.

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Cite This Study

Sun et al. (2026) studied this question.

synapsesocial.com/papers/6a05684ea550a87e60a20b84https://doi.org/10.1360/ssi-2025-0423
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