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June 1, 1994IEEE Transactions on Reliability107 citations

Failure mechanism models for electromigration

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DYD. YoungACA. Christou

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Abstract

This tutorial illustrates situations where electromigration (a wearout failure mechanism) in electronic devices can degrade performance. Electromigration and its relation to microstructure is discussed. Temperature considerations are treated. A practical model for electromigration and two application examples of it are given. Qualitative design procedures for avoiding solid-state electromigration failure are briefly discussed.>

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Young et al. (1994) studied this question.

synapsesocial.com/papers/6a5eb8364b5cbccdc30674adhttps://doi.org/10.1109/24.294986
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