This tutorial illustrates situations where electromigration (a wearout failure mechanism) in electronic devices can degrade performance. Electromigration and its relation to microstructure is discussed. Temperature considerations are treated. A practical model for electromigration and two application examples of it are given. Qualitative design procedures for avoiding solid-state electromigration failure are briefly discussed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Young et al. (1994) studied this question.
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