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The influence of Mo and ZrO 2 nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated. The interfacial microstructures of Sn58Bi/Cu, Sn58Bi + Mo/Cu and Sn58Bi + ZrO 2 /Cu solder joints were analysed using a scanning electron microscope (SEM) coupled with energy dispersive X-ray (EDX) and the X-ray diffraction (XRD). Intermetallic compounds (IMCs) of MoSn 2 are detected in the Sn58Bi + Mo/Cu solder joint, while SnZr, Zr 5 Sn 3 , ZrCu and ZrSn 2 are detected in Sn58Bi + ZrO 2 /Cu solder joint. IMC layers for both composite solders comprise of Cu 6 Sn 5 and Cu 3 Sn. The SEM images of these layers were used to measure the IMC layer’s thickness. The average IMC layer’s thickness is 1.4431 µm for Sn58Bi + Mo/Cu and 0.9112 µm for Sn58Bi + ZrO 2 /Cu solder joints. Shear strength of the solder joints was investigated via the single shear lap test method. The average maximum load and shear stress of the Sn58Bi + Mo/Cu and Sn58Bi + ZrO 2 /Cu solder joints are increased by 33% and 69%, respectively, as compared to those of the Sn58Bi/Cu solder joint. By comparing both composite solder joints, the latter prevails better as adding smaller sized ZrO 2 nanoparticles improves the interfacial properties granting a stronger solder joint.
Singh et al. (Thu,) studied this question.