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Gold thin films were deposited on quartz substrates by DC magnetron sputtering to fabricate electrodes for electrochemical and resistive sensing applications. The influence of sputtering parameters on film thickness, structure, and electrical properties was systematically investigated. XRD analysis revealed a predominant (111) crystallographic orientation. Microstrain values, determined via Williamson–Hall (W–H) analysis, were low (below 0.013) and closely correlated with surface roughness trends. AFM measurements showed that the surface roughness increased with film thickness. Electrical resistivity decreased linearly with increasing thickness and exhibited a critical grain size of approximately 25 nm, beyond which conductivity improved markedly. These results demonstrate the strong dependence of Au thin-film morphology and performance on deposition conditions, offering practical guidelines for optimizing their application in functional sensing devices.
Bulowski et al. (Fri,) studied this question.