Phase Field Damage Framework for Modeling Thin-Film Silicon Anodes in All-Solid-State Batteries

Recent advancements in solid electrolyte research have revived interest in the concept of silicon anodes for All-Solid-State Batteries (aSSBs). Tan et al. have recently proposed stable cyclic performance of micro-grain size pure silicon anodes paired with sulfide-based solid electrolytes 1. This development has opened pathways toward potential aSSBs without encountering dendrite growth issues. This rediscovery of the thin-film a-silicon anodes concept has sparked computational interest in simulating the fracture-chemo-mechanical silicon lithiation mechanism. Understanding chemical reactions during lithiation and crack evolution during de-lithiation processes are intriguing topics. Especially, elastic-plastic deformation coupled with phase-field continuous fracture is crucial in comprehending the underlying physics and enhancing performance of battery cell through reverse engineering approaches. In this work, we develop a thermodynamically consistent deformation-diffusion-damage coupled framework to model the evolution of dense, thin-film-like a-silicon anodes during lithiation and delithiation. During delithiation, tensile stress develops inside the film as the lithiated film overcomes the initial stack pressure and compressive stress prevalent during lithiation. As tensile stress and strain evolve, randomly distributed weak spots lead to crack nucleation. This fracture occurs throughout the silicon film, forming sharp vertical cracks, and depending on surface conditions along the solid-state electrolyte, some interfacial cracks may emerge, leading to permanent contact loss and resulting in capacity reduction. From the model, we observed “mud crack” like phenomena, where crack distribution is not controlled by particle’s property, but entire cluster’s thickness matters. While flat model suggests that one that nucleate the crack was weak spots where they make stress concentration over entire body, whether they can evolve into big vertical crack mostly governed by connectivity of such weak spot maps. However, from our interface roughness model, what governs the crack evolution most was not the randomly distributed weak spot, but its geometric relative thickness difference between one another. Due to manufacturing process, perfect interface is hard to be achieved and such geometric irregularity always exist, thus, additive and binder studies along the silicon anode and its interface between sse would be key to achieve long and stable life span for a-silicon based aSSBs. Reference 1 Tan, Darren HS, et al. "Carbon-free high-loading silicon anodes enabled by sulfide solid electrolytes." Science 373.6562 (2021): 1494-1499.