Key points are not available for this paper at this time.
In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV) interposers will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV interposer. Also, some recommendations will be provided.
John H. Lau (Sun,) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: