Particle removal behavior of composite surfactants during the post-CMP cleaning process for Co-patterned wafers

Key Points

• Enhanced particle removal during the post-CMP cleaning process is observed, demonstrating better effectiveness.
• The presence of composite surfactants facilitates the removal of particles across various surface tensions and conditions.
• Analysis of composite surfactants shows the influence of their unique properties on post-CMP cleaning efficacy.
• Improved cleaning strategies can significantly advance the quality of co-patterned wafers, which are critical in semiconductor fabrication.