Fraunhofer Institute for Reliability and Microintegration

Recent papers from Fraunhofer Institute for Reliability and Microintegration

1. Fabrication of a thin, flexible chip package using liquid crystal polymersMicroelectronics Journal · 2026
2. Mechanical Durability of Polymer-Encapsulated Electronic Yarns for Electronic Textile ApplicationsPolymers · 2026
3. A consolidated analysis of present and future battery material compositionJournal of Energy Storage · 2026
4. Homogeneity of nanoparticle layers as deposited by gas phase condensation and co-deposited with PECVD processesVacuum · 2026
5. High-Reliability Signal Quality Validation for Biosignals Using Sensor Fusion and Software IndicesSensors · 2026
6. Jet-Dispensing Process Development for a Microparticle-Based Ag Sintering Paste for Pressureless Sintering of Miniaturized Opto-Electronic ComponentsJournal of Microelectronics and Electronic Packaging · 2026
7. FutuRaM Project Final Report - draft2026
8. Artificial intelligence for stored product insect detection and control with laser beams: the Insect Laser projectJournal of Plant Diseases and Protection · 2026
9. Recycling of Scrap Metal from Multifunctional Aluminum-Based Electronic Device HousingsRecycling · 2026
10. Homogeneity of matrix and nanocomposite layers as deposited by gas phase condensation (GPC) and PECVD processesSurfaces and Interfaces · 2026
11. Proposal on Secondary Raw Materials Statistics to the European Commission - draft2026
12. On the stability of CMOS ICs with plasma-enhanced silicone encapsulation for active implantable neurotechnology: 4.3 years of accelerated life testingFrontiers in Electronics · 2026
13. Highly conductive silver layers with self-healing abilities for stretchable electronics and beyondAdvanced Composites and Hybrid Materials · 2026
14. Unlocking Circularity Potentials from LMT Batteries: A Material Flow Analysis and Scenario Forecast on Secondary Raw Materials for Europe2026
15. Glass Interposer Assisted Edge Coupling to SiN Photonic Integrated CircuitsACS Photonics · 2026
16. Heterogeneous Integration of Magnetic Spin Wave and CMOS Chips into a Hybrid Computing SystemIMAPSource Proceedings · 2025
17. Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O ComponentsIMAPSource Proceedings · 2025
18. On the hunt for the PO radical: How substrate interactions shape the gas-phase mechanism of phosphoramidate flame retardantsPolymer Degradation and Stability · 2026
19. Transparent Transfer‐Free Ultrasmall Multilayer Graphene Microelectrodes Enable High Quality Recordings in Brain SlicesAdvanced Science · 2026
20. Ultrasound-transparent neural interfaces for multimodal interactionnpj Flexible Electronics · 2026