Advanced Semiconductor Engineering (Taiwan)

Recent papers from Advanced Semiconductor Engineering (Taiwan)

1. AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic PackagingJournal of Failure Analysis and Prevention · 2026
2. Integrative Analysis of Gut Microbiota and Metabolome Reveals Health Benefits of Postbiotic Supplementation in Asian Seabass (Lates calcarifer)Biology · 2026
3. Design Considerations and Structural Characteristics of Greenhouses for Subtropical and Tropical RegionsAgriEngineering · 2026
4. Joint geophysical surveys for underwater cultural heritage investigation: An example from the Taijiang Waters in TaiwanNear Surface Geophysics · 2026
5. Automated segmentation reveals sex-divergent age-related decline in temporalis muscle volume among Asian adultsScientific Reports · 2026
6. Evaluation of plasticizer release from food contact tinplate coatings across various extraction and simulation conditionsLWT · 2026
7. Exploring Spatial Distribution of Intrinsic Oxide Trap by Decoupling Channel Thickness Effects in Amorphous IGZO TFTsACS Applied Materials & Interfaces · 2026
8. Waterjet Injection Technology to Enhance Bioremediation of Chlorinated Solvents ContaminationWater Environment Research · 2026
9. An Exact Geometric Identity for the Fine Structure Constant: A Relativistic Analogue of the Bohr Model2026
10. Epitaxial Bi ₂ O ₂ Se/Bi ₂ O ₅ Se Thin Films: Revealing Electric‐Field‐Driven Oxidation and Resistive Switching Dynamics for Advanced Memory DevicesAdvanced Science · 2026
11. Gradient Doping Triggers Flexo-Pyroelectric Effects toward Self-Powered Broadband Photodetection and Smart RecognitionACS Applied Materials & Interfaces · 2026
12. Engineering High-Quality Crack-Free AlN on Si(111) by a Hybrid 3D/2D Growth Mode in MOCVDCrystal Growth & Design · 2026
13. Biodegradable triboelectric materials for sustainable mechanical energy harvestingResults in Engineering · 2026
14. The Optimization of Non-Uniformity for Copper Electrodeposition with a Tertiary Current Distribution Numerical ModelElectrochem · 2026
15. Development of an object pickup method in the downwash environment on a drone and uneven ground surfaceThe Proceedings of Mechanical Engineering Congress Japan · 2025
16. Warpage Evaluation in Embedded Bridge Package for Advanced Package SolutionsIMAPSource Proceedings · 2025
17. Two Kelvin Operation of Ultrawide-Bandgap β-Ga ₂ O ₃ FinFETs and Logic Inverter Integrated CircuitsNano Letters · 2026
18. Nondestructive detection and identification of electrically active threading dislocations in n ⁺ -SiC substratesNanoscale Advances · 2025
19. Integrated UV/IR-cut optical filter with nanoimprinted pyramid diffuser featuring tailored light diffusion and hydrophobicityMicro and Nano Engineering · 2025
20. Ultra-Sensitive 3D Lateral Flow Assay Device for SARS-CoV-2 Detection Based on One-Step Dual-Signal AmplificationAnalytical Chemistry · 2025