SK Group (United States)

Recent papers from SK Group (United States)

1. From Pixels to Physicality: Wave-Mediated Interaction above a Screen2026
2. Memory Window Improvement in Ferroelectric Thin-Film Transistors with HfZrO2/AlN Bilayers Grown by Atomic Layer DepositionACS Nano · 2026
3. Electron injection in tunneling-oxide-less charge-trap flash memoriesApplied Physics Letters · 2026
4. Consequence Assessment of a 440 L Propylene Y-Cylinder Gas Cabinet in Semiconductor Gas Supply SystemsProcesses · 2026
5. Hybrid approximate-accurate neural network using vertical NAND flash memoryNano Energy · 2026
6. Electroforming‐Free, Self‐Rectifying Selector‐Only Memory With Diffusive Cu‐Ion Dynamics for Logic‐In‐Memory ComputingAdvanced Science · 2026
7. Triple‐Level Content‐Addressable Vertical NAND Flash MemoryAdvanced Science · 2026
8. Determining the Relationship Between Composition, Structure, and Device Properties of Ge x Se 1‐x ‐Based Selector‐Only MemoryAdvanced Electronic Materials · 2026
9. Atomic Layer Deposition of High-Density GeSe Films for Stable Vertical Ovonic Threshold Switching and Selector-Only MemoryChemistry of Materials · 2026
10. Deep Learning-Based Safety Legislation Recommendation System for Construction Safety ReportsBuildings · 2026
11. Electrochemical Metallization Memristors: From Bulk to 2D MaterialsAdvanced Functional Materials · 2026
12. Analytical circuit modeling of FSS–plasma structures: Analysis on reflection reduction mechanismsPhysics of Plasmas · 2026
13. A Memristor‐Based In‐Memory Computing System‐on‐Chip with Efficient Depthwise ConvolutionAdvanced Intelligent Systems · 2026
14. Ising Solver Using Vertical NAND Flash MemoryAdvanced Intelligent Systems · 2026
15. Stepwise and Selective Missing-Value Imputation for Machine Learning-Based Process Monitoring and Diagnosis of High-Speed DRAM Peripheral DevicesMaterials Today Electronics · 2026
16. Thermal conductivity reduction in silicon nanotubes through phonon localizationNano Energy · 2026
17. Temporal-enhanced semiconductor yield prediction by combining equipment usage data and accumulated cycle time dataThe International Journal of Advanced Manufacturing Technology · 2026
18. Synergistic Effect of MoS ₂ Incorporation and Post‐Annealing UV/Ozone Treatment on Solution‐Processed In ₂ O ₃ TFTsphysica status solidi (RRL) - Rapid Research Letters · 2026
19. Surface Chemistry Effects on Bond Wave Dynamics and Distortion-Induced Scaling Errors during Plasma-Activated Direct Bonding of SiCNACS Applied Electronic Materials · 2026
20. Degradation Pathways and Energy Efficiency on Non-Thermal Plasma for Sulfonamide Antibiotics Removal: A Comparative StudyProcesses · 2026