STMicroelectronics (Singapore)

Recent papers from STMicroelectronics (Singapore)

1. Trench super junction power device by plasma doping: a structural, chemical-physical, and profiling investigationSemiconductor Science and Technology · 2025
2. Adaptive Hybrid Switched-Capacitor Cell Balancing for 4-Cell Li-Ion Battery Pack with a Study of Pulse-Frequency Modulation ControlJournal of Low Power Electronics and Applications · 2025
3. Beam and Cantilever Supported PMUTs for Enhanced Transmit Sensitivity and LinearityIEEE Sensors Journal · 2025
4. A Novel Multi-Angle Spatial Compounding Methodology Toward High-Resolution PMUT-Based ImagingIEEE Sensors Journal · 2025
5. Design and Analysis of a Novel 12-Bit Current-Steering–Capacitive Digital-to-Analog ConverterJournal of Low Power Electronics and Applications · 2025
6. Demonstration of Low Interface Trap Density (~3×10¹¹eV⁻¹cm⁻²) SiC/SiO₂ MOS Capacitor with Excellent Performance Using H₂+NO POA Treatment for SiC Power Devices2024
7. A CMOS Rectifier with a Wide Dynamic Range Using Switchable Self-Bias Polarity for a Radio Frequency HarvesterElectronics · 2024
8. Recent Development of High-PCE CMOS RF-DC Rectifier With Wide PIN Dynamic Range: Strategies and Trends—ReviewIEEE Access · 2024
9. Design and Development of Printable Prosthetic Foot using Acrylonitrile Butadiene Styrene (ABS) for Below Knee Amputation (BKA)Malaysian Journal on Composites Science and Manufacturing · 2023
10. Motion Retrieval Using Probability Graph Model2013
11. Characteristics of the Electrical Percolation in Carbon Nanotubes/Polymer NanocompositesThe Journal of Physical Chemistry C · 2011
12. Comments on "Variable Explicit Regularization in Affine Projection Algorithm: Robustness Issues and Optimal ChoiceIEEE Transactions on Signal Processing · 2010
13. Numerical and Experimental Study of Interface Delamination in Flip Chip BGA PackageJournal of Electronic Packaging · 2010
14. Thickness-Dependent Reversible Hydrogenation of Graphene LayersACS Nano · 2009
15. A Low-Complexity Kalman Approach for Channel Estimation in Doubly-Selective OFDM SystemsIEEE Signal Processing Letters · 2009
16. Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage AnalysisJournal of Electronic Packaging · 2009
17. Local bond average for the size and temperature dependence of elastic and vibronic properties of nanostructuresInternational Journal of Nanotechnology · 2009
18. Temperature dependence of the elastic and vibronic behavior of Si, Ge, and diamond crystalsJournal of Applied Physics · 2007
19. Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packagingMicroelectronics International · 2007
20. Size, temperature, and bond nature dependence of elasticity and its derivatives on extensibility, Debye temperature, and heat capacity of nanostructuresPhysical Review B · 2007