A Review of Advanced Materials and Micro-Nano Manufacturing Strategies for Flexible MEMS

As the demand for lightweight and flexible sensing in wearable devices and biocompatible devices surges, material properties and micro- and nano-processing have become the biggest obstacles to the industrialization of flexible MEMS. This paper compares the advantages and disadvantages of two PI film preparation routes, liquid-phase polymerization and vapor-phase deposition, in terms of temperature compatibility and batch potential, analyzes the trade-offs between thermal robustness, tensile flexibility, and environmental tolerance of PI, PDMS, and liquid-metal interconnect systems, and reviews the challenges of adapting three-dimensional assembly methods, such as low-temperature bonding, self-driven folding, and stacked lithography. Based on case comparisons, this paper proposes three major directions: optimizing the low-temperature speed curing process, constructing multi-physical field simulation models, and improving system-level reliability testing. This work provides a clear and feasible roadmap for realizing flexible MEMS from lab to marketable applications.