Microengineered Flexible Pressure Sensors with Sacrificial Molding Layer: A Novel Fabrication Approach for Improved Performance

Recent research aims to improve the performance of flexible pressure sensors by microengineering their active layer. However, current fabrication approaches often require a trade-off between scalability, miniaturization, and performance. To overcome these limitations, we propose a novel technique that involves stacking all sensor layers on a carrier wafer and shaping the active layer into micro-cones using a sacrificial mold. Precise miniaturization through photolithography techniques improves mapping resolution, useful for object recognition applications. This method offers enhanced ease of fabrication, versatility in shape and size, and tunability, potentially improving the efficacy of flexible pressure sensors for various applications.