Fabrication of superhydrophobic Cu/MXene composite coatings with robustness and corrosion resistance based on flexible substrates by electrodeposition and surface modification

Flexible conductive films (FCFs) used in flexible electronics are susceptible to degradation when exposed to humid air and perspiration, which can interfere with circuit functionality and reduce their service life. To mitigate this, we engineer hierarchical superhydrophobic Cu/MXene composite coatings on Ag-coated polyimide substrates through electrodeposition followed by stearic acid functionalization. By optimizing the electrodeposition parameters, adjustable surface roughness and wettability were achieved. The resulting coatings reached the Cassie–Baxter state at a current density of 1.5[Formula: see text]A/dm 2 and an electrodeposition time of 15[Formula: see text]min, with excellent superhydrophobicity, with a contact angle of [Formula: see text] and a sliding angle of [Formula: see text]. Electrochemical tests revealed that the superhydrophobic Cu/MXene composite coatings exhibited a significantly lower corrosion current density ([Formula: see text][Formula: see text][Formula: see text]) and a more positive corrosion potential ([Formula: see text][Formula: see text]V) in 3.5[Formula: see text]wt% NaCl solution with a corrosion inhibition efficiency of 99.69% compared to bare copper coatings, indicating superior corrosion resistance. Moreover, the as-prepared superhydrophobic coatings demonstrated excellent mechanical and chemical stability (including 7 cycles of sandpaper abrasion, 8000 droplets impact and pH tests), along with antifouling and self-cleaning properties. This interfacial engineering strategy provides a physical barrier against corrosion, offering a universal approach to enhance the environmental robustness of flexible electronics.