Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications

As power electronic modules are increasingly required to provide improved heat dissipation, aluminum nitride (AlN) stands out against other ceramic materials. At the same time, more cost-efficient production of customized products demands shorter development cycles and innovative manufacturing processes. Conventional process chains in power electronics are usually long and inflexible; thus, innovative ways to reduce process steps and faster prototyping are needed. Therefore, this study investigates the usage of additive manufacturing technology—laser-based powder bed fusion of metal powder (PBF-LB/M)—namely copper (Cu), on AlN substrates for power electronic applications. It is found that specific electrical conductivity values can be achieved up to 31 MS/m, and adhesion measured by shear testing reaches 15 MPa. In reliability testing, the newly produced samples exhibit a 25% decrease in adhesion after 250 cycles, which is comparatively moderate. This study shows the feasibility of PBF-LB/M of Cu powder on AlN, emphasizing its strengths and highlighting remaining weaknesses.