Research demonstrates temperature distribution in silicon steel mold, indicating heat flow efficiency and structural soundness.
A full range overall heat flux density distribution curve of the hot surface of a copper plate along the casting direction has been built. Most researchers use local heat flux density approximation function expressions. It cannot truly reflect the heat flux density of copper plates in slab continuous casting mold in current production sites. By embedding thermocouples in the copper plate and using the reverse heat transfer method verified by measured temperature data, the original local heat flux density distribution along the casting direction was corrected to obtain numerical simulation data that was closer to real industrial production. A finite element model of the temperature field of the chamfered copper plate and a shrinkage model of the chamfered slab shell were established using ANSYS finite element software. The temperature distribution of the silicon steel slab chamfered mold copper plate and shell shrinkage distribution of the mold slab in a certain factory was obtained. From the research results, the chamfering design and sink setting of the factory’s chamfered copper plate are reasonable, and the temperature distribution of the copper plate near the chamfering is uniform, with relatively low-temperature values. The shrinkage of the silicon steel slab’s chamfered area is greater than that of the narrow surface center, and the area with the largest shrinkage is at the junction of the chamfer and the narrow surface, which the width-wise shrinkage at the exit of the mold reaches 5.61 mm. According to the numerical simulation results, the current structure of the multi-taper chamfering mold for silicon steel is reasonable, which helps to transfer heat evenly at the chamfering area and avoid corner defects.
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Wang et al. (2025) studied this question.
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