Investigation on the Interfacial Delamination of Glass Substrate Packaging Using Cohesive Zone Models

This study aligns with the development trend of glass substrate packaging. The research aims to analyze the delamination of the substrate–adhesive layer-chip trilayer structure in packaging through experimental testing to obtain interface strength parameters. Subsequently, an iterative process combining experiments and simulations was applied to establish a cohesive zone model characterizing crack initiation and propagation. Finally, reliability analysis of the packaging structure was conducted. The results indicate that the load–displacement curves during sample loading can be experimentally acquired, enabling the determination of critical load values triggering interface delamination. The specific locations of delamination within the packaging structure are also clearly observed. Through simulation fitting, cohesive parameters reflecting interface strength are obtained, which serve as the basis for evaluating interface delamination fractures. Furthermore, applying the calibrated cohesive parameters to the established glass substrate model, simulation analysis evaluates delamination risks under thermal conditions.