Delamination at the resin-copper interface is fully characterized during operative conditions by adopting a combined experimental and numerical approach. Peeling and four-point bending fracture tests are used along with cohesive zone models to reach this purpose. The promising findings are beneficial to analyze the crack propagation at the interface during package-oriented reliability tests, and may therefore be employed to enhance these interfaces in microelectronic plastic packages.
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Rovitto et al. (2024) studied this question.
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