This analysis demonstrates interfacial toughness in printed wiring boards, highlighting its relation to shear stress.
The paper describes a fracture mechanics approach for measuring the adhesion between components of printed wiring board assemblies. In particular, the toughness of the interface between a model printed wiring board (PWB) and a copper/molybdenum/copper (CMC) core was determined over a range of mode-mixes. A CMC/PWB/CMC sandwich specimen was subjected to various bending loads in order to obtain the different mode mixes. Toughnesses were extracted from compliance measurements which were also compared with analytical and finite element solutions. The interfacial toughness increased considerably with increasing shear.
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Watson et al. (1995) studied this question.
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