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This research reveals improved thermal resistance in Si/III-V lasers, suggesting advancements for integrated photonic systems.
This study investigates the optimization of a Si/III-V single-longitudinal-mode laser source using a time-domain traveling-wave (TDTW) model. Additionally, a low-thermal-resistance Si/III-V 3D heterogeneous integration structure is proposed. The device's thermal resistance decreased from 48.8°C/W to 18.0°C/W based on this structure. This work boosts both optical efficiency and thermal management of heterogeneously integrated Si/III-V lasers. The results offer a viable solution for future integrated photonic systems.
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Tian et al. (2025) studied this question.
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