Analysis reveals the Find Plane Algorithm significantly reduces false calls and enhances defect detection in automated optical inspection of SMT components.
Automated Optical Inspection (AOI) systems are indispensable for ensuring the quality of electronic components in modern manufacturing. The Find Plane Algorithm stands out as a key element dedicated to verifying component presence in AOI inspection. The algorithm scrutinizes the height of each Surface Mount Technology (SMT) component, confirming their adherence to predefined tolerance ranges while flagging those that deviate significantly as potential defects during the inspection process. This is a common occurrence in SMT assembly after completing one side of a double-sided assembly. To combat the false call issue, the fine plane algorithm offers the flexibility to adjust tolerance limits, which is a critical feature in AOI inspection. This effort has been explored in the context of Mini-Dual Inline Memory Modules (MiniDIMM) and Dual Inline Memory Modules (DIMM) modules. This research presents a detailed analysis of the Find Plane Algorithm's application, emphasizing its role in reducing false calls and enhancing the overall effectiveness and dependability of the inspection process. The inferences derived from experimentation demonstrate the adaptability of the algorithm, allowing it to effectively address distinct LinkIDs, various component types, and tolerance limits. By strategically modifying these limits, substantial reductions in false calls are achieved, paralleled with improvements in yield, defect detection precision, and a reduction in the Defects Per Million Opportunities and Parts Per Million metrics. This algorithm enhance the AOI inspection program in terms of authenticity of the program as well as false call reduction during inspection of SMT manufacturing process.
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Trivedi et al. (2024) studied this question.
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