Modeling the Use of a Piezo Cooler to Intensify Heat Exchange in Sealed Device Housings

. The paper discusses a method for intensifying heat transfer of a REA unit in a hermetically sealed housing. A simplified mathematical model simulating passive and active cooling of the unit's internal space by natural and forced convection has been developed and calculated. Data on air flow velocities in gaps, the thermal field, and temperature differences between the housing and the internal unit for different types of cooling have been obtained.