Dynamic Heat Dissipation in Electronics Using Nano‐Encapsulated Phase Change Material and Hybrid Convection–Radiation Strategies

Thermal regulation in miniaturized electronics with heterogeneous heat generation profiles has emerged as a pivotal challenge for sustaining performance and reliability in next‐generation technologies. To address these thermal challenges, this study explores an electronic cooling system combining nano‐encapsulated phase change material (NEPCM) with convection–radiation coupling. The system features a partitioned cavity with three different heat‐generating blocks, divided by a conductive plate into an open section (cooled by natural convection and radiation) and a porous closed section saturated with NEPCM. Using the Galerkin finite element method, cooling efficiency is analyzed across critical parameters: PCM properties (melting temperature T f = 300–315 K, Stefan number Ste = 0.4–1), plate geometry (thickness e = 0.04–0.24 cm, displacement d = 2.7–3.6 cm), radiative effects (emissivity ε = 0.1–0.9), nanoparticle concentration (%), porous media ( Da = 10 −5 –10 −2 ) and the cavity inclination angle ( to ). The findings reveal that the maximum temperatures of the blocks can vary significantly, with reductions exceeding 7% when key parameters, such as Darcy number and cavity inclination angle, are optimized. In contrast, other parameters have a more limited influence, resulting in variations not exceeding 2%. These insights highlight the importance of selecting appropriate parameters for enhanced thermal management in electronic applications.