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This study explores the thermal performance of phase change material (PCM)-integrated heat sinks for electronic devices.

June 12, 2026Journal of Materials Science Materials in EngineeringOpen Access

Experimental and numerical investigation of Phase Change Material (PCM) heatsink for electronic thermal management applications

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This study explores the thermal performance of phase change material (PCM)-integrated heat sinks for electronic devices.
Acrylic heat sinks with paraffin-based PCMs tested under free convection conditions.
A three-dimensional transient numerical model developed using the enthalpy–porosity method for simulation.
Different PCM melting temperatures and thicknesses assessed under heat inputs of 5 to 15 W.
PCM integration reduces temperature rise and enhances thermal stability compared to conventional heat sinks.
Increasing PCM thickness from 60 to 120 mm extends thermal regulation up to 50 min at 5 W and 35 min at 15 W.
Higher melting temperature PCMs prolong thermal regulation but result in higher final operating temperatures.

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Randomized trial investigates thermal performance of PCM-integrated heat sinks for electronics, indicating crucial design choices.

Husainy et al. (2026) studied this question.

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