Integrated Alkali Gradient pH Control Purification of Acidic Copper-Containing Etching Waste Solution and Cu2(OH)3Cl Conversion-Calcination Process for High-Purity CuO

With the rapid advances of the electronics industry, a large amount of acidic etching waste solutions (AEWS) for etching Printed Circuit Board (PCB) are generated, which require complete remediation and sustainable recycling to avoid environmental pollution and wasting of resources. Herein, the novel purification technology for the acidic copper-containing etching waste solution was exploited via integrated alkali gradient pH control (3.0, 3.2, and 3.5). At pH 3.0, the system demonstrated selective metal removal with 94.02% efficiency for Fe and 82.60% for Mn. Elevating the pH to 3.2 enabled effective elimination of Zn (59.32%), Cr (59.46%), and Al (33.24%), while maintaining minimal copper loss (8.16%). Further pH adjustment to 3.5 achieved enhanced removal efficiencies of 97.86% (Fe), 91.30% (Mn), 59.38% (Zn), 62.10% (Cr), 21.66% (Ca), 34.05% (Al), and 26.66% (Co), with copper retention remaining high at 70.83% (29.17% loss). Furthermore, using the purified AEWS (pH 3.2) as precursor, high-purity nano-CuO was successfully synthesized through a Cu2(OH)3Cl conversion-calcination process, exhibiting 99.20% CuO purity with 0.0012% chlorine content and <0.1% metallic impurities. The development and application of the purification technology for AEWS containing copper, along with the production methodology for high-purity CuO, were significant to the fields of electronic information industry, environmental engineering, green industry and sustainable development of the ecological environment.