Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting

Electrohydrodynamic (EHD) printing offers mask-free, high-resolution deposition across a broad range of ink viscosities, yet combining void-free filling of high-aspect-ratio through-glass vias (TGVs) with ultrafine drop-on-demand (DOD) line printing on the same platform requires balancing conflicting requirements: for example, high field strengths to drive ink into deep and narrow vias; sufficiently high ink viscosity to prevent gravity-induced leakage; and stable meniscus dynamics to avoid satellite droplets and charge accumulation on the glass surface. By coupling electrostatic field analysis with transient level-set simulations, we establish a dimensionless regime map that delineates stable cone-jetting regime; these predictions are validated by high-speed imaging and surface profilometry. Operating within this window, the platform achieves complete, void-free filling of 200 µm × 1.52 mm TGVs and continuous 10 µm-wide traces in a single print pass. Demonstrating its capabilities, we fabricate transparent Ku-band substrate-integrated waveguide antennas on borosilicate glass: the printed vias and arc feed elements exhibit a reflection coefficient minimum of −18 dB at 14.2 GHz, a −10 dB bandwidth of 12.8–16.2 GHz, and an 8 dBi peak gain with 37° beam tilt, closely matching full-wave predictions. This physics-driven, all-in-one EHD approach provides a scalable route to high-performance, glass-integrated RF devices and transparent electronics.