This review evaluates condition monitoring technologies in modular multilevel converter HVDC systems, suggesting improvements and future trends.
This paper provides an in-depth review of degradation mechanisms and condition monitoring methods for critical components in modular multilevel converter (MMC) high-voltage direct current (HVDC) systems, including insulated gate bipolar transistors (IGBTs), metallized film capacitors, and cross-linked polyethylene (XLPE) DC cables. This study systematically evaluates the strengths and limitations of existing technologies, while also projecting future trends in technological advancements. By exploring the multi-fields-coupled degradation processes of these components, the mechanisms of switching oscillations, and the flexible and controllable applications of MMC, this review offers valuable insights for improving the accuracy, real-time performance, and reliability of component condition monitoring. The findings aim to contribute to the advancement and broader application of MMC HVDC systems in modern power networks.
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Yao et al. (2025) studied this question.
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