This paper explores processes like lithography and wafer preparation in chip manufacturing, suggesting future innovations.
As integrated circuits get smaller and approach their physical limits, semiconductor technology has shifted from micrometer to nanometer scales. Chip manufacturing has advanced quickly over recent decades, moving from early 70-nanometer chips to today's state-of-the-art 2-nanometer processors. These technological breakthroughs have made integrated circuit manufacturing processes essential to the chip industry's growth. This paper examines the primary steps in integrated circuit production, including wafer preparation, layer deposition, and lithography. It also examines how these processes are applied in industrial manufacturing, artificial intelligence, and mobile technology. The paper concludes by discussing future developments and challenges in integrated circuit technology, highlighting the importance of continued innovation in this field, and provides a brief outlook.
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Yuan Cao (2025) studied this question.
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