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The paper presents the results of research to determine the requirements for the structure and materials of printed circuit boards to substantiate the design of active phased antenna arrays (AFAR). The calculation of loads and stresses, as well as the analysis of the thermal regime of the on-board X-band antenna array, is carried out. The results obtained are of great importance for the development of modern microelectronics technologies in the field of high-speed data transmission from aircraft.
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Жданов et al. (2025) studied this question.
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