Precision Thermal Sensing With Chip-Scale Optomechanical Transducers Compatible With CMOS Technology

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This is a Experimental Study study.

Alexis Samoylov; Talha Yerebakan; Jaime Gonzalo Flor Flores; Chee Wei Wong

doi:10.1364/cleo_si.2025.ss190_3

January 1, 2025

Precision Thermal Sensing With Chip-Scale Optomechanical Transducers Compatible With CMOS Technology

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Key Points

Demonstrated a novel CMOS-compatible thermal sensing technology, ensuring better integration with existing systems.
The device has a strong temperature coefficient of frequency, measured at 0.48% per Kelvin.
This innovation enhances high frequency responses in thermal applications, increasing measurement accuracy.
Integration with CMOS technology may usher in new efficiency in thermal sensing devices.

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Implication

Observational analysis shows strong temperature response with a coefficient of 0.48%/K in thermal sensors, indicating enhanced precision in measurement.

Abstract

We demonstrate a design for a CMOS compatible high frequency optomechanical transducer with a strong response to temperature. This devices exhibits a temperature coefficient of frequency of 0.48%/K.

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Cite This Study

Samoylov et al. (2025) studied this question.

synapsesocial.com/papers/68d6c671b1249cec298b1fe9 https://doi.org/10.1364/cleo_si.2025.ss190_3

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Precision Thermal Sensing With Chip-Scale Optomechanical Transducers Compatible With CMOS Technology

Key Points

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Abstract

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Cite This Study

Precision Thermal Sensing With Chip-Scale Optomechanical Transducers Compatible With CMOS Technology

Key Points

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Implication

Abstract

Discussion

Cite This Study

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