Optimizing the Performance of the Air‐Cooled Microchip by the Heat Sink

In the current scenario, the heat generation and overheating of the miniature devices are a big problem. Moreover, the excess heat generation due to the reduction in size of the microchips will cause overheating and burning of electronic devices. For resolving this issue, in this article, an air‐cooled heat sink for the size of the electronic chip, 10 × 10 × 1 mm, is proposed. The temperature, velocity and pressure contours are found by using a Computational Fluid Dynamics tool. Also, a Nusselt number, heat transfer coefficient and fan power have been calculated to estimate the performance of the heat sink. The inlet air velocity, inlet air temperature and heat generation are three important variables that control the temperature of the chip. Numeric optimization was performed for the chip using Response Surface Methodology (RSM) with the aid of MINITAB and Design Expert software to determine the best operational conditions. In the optimization, the device chip temperature should be below 50°C, and it is the main optimization constraint. The outcomes of the study indicate that as the inlet air velocity increases, the chip temperature reduces, but increasing the inlet air temperature and heat generation enhances the chip temperature. Furthermore, the numerical results are validated with the experimental results of the heat sink at optimum conditions.