3D SLA Fabrication and Parametric Optimization of Electrically Functional Nickel–Polymer Composites

This study investigates the production of photopolymer‐based nickel‐filled composite structures using 3D Stereolithography (SLA) method, and the effects of this method on electrical conductivity. This approach, developed to overcome the limitations of traditional composite production methods, offers significant advantages, especially in the production of lightweight, flexible, and functional materials. In the study, electrical conductivity results were investigated by varying the nickel doping ratio (0.4%, 0.6%, and 0.8%), layer height (0.02, 0.03, and 0.04 mm), and exposure time (12, 18, and 24 s). As a result of electrical conductivity measurements, the highest conductivity was obtained as 1.01 × 10 −6 S/m with 0.8% nickel doping, 0.04 mm layer thickness, and 24 s exposure time. SEM analysis showed that conductive paths were formed by well‐distributing the dendritic nickel particles in the matrix. FTIR and XRD characterizations revealed that nickel is not only a physical reinforcement but also contributes to forming percolation networks by chemically interacting with the matrix. Taguchi analysis and variance analysis showed that the nickel doping ratio was the most dominant variable affecting electrical conductivity (91.6% contribution rate). The findings demonstrate that metal‐reinforced polymer composites produced using the SLA method has high potential in high‐technology applications such as sensors, flexible circuits, and EMI shielding.