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September 30, 2025Celal Bayar Üniversitesi Fen Bilimleri DergisiOpen Access

Evaluation of the thermal performance of a cold plate with different fin structures for IGBT cooling

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Authors

MAM. Bahattin AkgülFEFurkan Sinan Erçel

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Implication

Numerical analysis reveals liquid cooling performance differences among fin structures in IGBTs, indicating effective cooling strategies.

Key Points

  • The staggered pin and oblique fin structures reduce thermal resistance by 46.5% and 60.1%, respectively, compared to straight fins.
  • Cooling performance variations highlight the importance of fin design in enhancing IGBT module efficiency under operation conditions.
  • Numerical analysis is conducted using CFD software to evaluate the heat dissipation capabilities of different cold plate designs.
  • The findings may enable improved cooling techniques for high power density applications involving power electronics.

Cite This Study

Akgül et al. (2025) studied this question.

synapsesocial.com/papers/68dc261d8a7d58c25ebb2a27https://doi.org/10.18466/cbayarfbe.1732854
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Also Consider

Synapse has enriched 2 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Thermal Management on IGBT Power Electronic Devices and Modules2018 · 348 citations
  2. 2Air-Cooling System Optimization for IGBT Modules in MMC Using Embedded O-Shaped Heat Pipes2021 · 48 citations