This paper explores key challenges in the development of advanced semiconductor memories for machine learning systems, focusing on optimizing switching and reading characteristics, improving device density, and enhancing stability and reliability. It highlights the growing importance of materials science in addressing issues across different memory technologies, such as HfO2-based ferroelectrics, phase-change materials, and ion-based memristive devices. The research emphasizes the need for a strong collaboration between material-level innovations and system-level design to achieve optimal device performance, particularly for highly parallelized operations in artificial neural networks. The discussion also touches on emerging trends in device scaling, including 3D architectures and multi-level cell technologies.
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Zhang et al. (2024) studied this question.
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